The paper is about measuring curing reaction of SY - 25 adhesive by usingDSC - 7 of PERKIN - ELMER Company.

本文用PERKIN-ELMER公司 (简称P-E公司)的DSC-7 仪器测定了 SY—25 胶膜的固化反应.

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The curing reaction can carry out easily at room temperature for one - component wet curing isocyanate adhesive.

单组分 湿固化异氰酸酯胶黏剂易发生反应,可常温固化.

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A special chemical that promotes or accelerates the curing reaction or reduces stoving temperature.

一种专门的化学材料,可以提升或促进固化反应或降低烘烤温度.

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The curing reaction of cationic polyacrylates with blocked isocyanates and amino resin was studied.

合成了阳离子型聚丙烯酸酯树脂,并分别用封闭型异氰酸酯及氨基树脂对其交联固化.

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The curing reaction of modified bismaleimide resin system was measured with DSC —7 instrument of Perkin — Elmer Company.

用PERKIN—ELMER公司的DSC—7仪器测定了改性双马来酰亚胺树脂体系的固化反应.

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The curing reaction of epoxy resin, which is common used in metal conductive paste, was studied.

主要研究了金属导电浆料中常用的环氧树脂的固化.

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