The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性.

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To be an advancing technology in capsulation, a well developing foreground for the thermosonic flip - chip bonding.

热超声倒装键合作为前沿封装技术具有良好的发展前景.

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The self - alignment mechanism of flip chip bonding can improve the precision and repeatability of laser coupling.

而透过覆晶封装自动对准的优点,可以改善雷射封装位置的准确性.

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