The heavy gauge lead frame is made of oxygen - free copper.

大尺寸引脚框由无氧铜制成.

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Principle and methods of local spot plating lead frame were briefly introduced.

简单介绍了局部电镀技术的原理及方法.

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The punching process of the lead frame was analyzed, the multi - position progressive die was designed.

分析了引线框的冲压工艺性, 设计出了 多工位 级进模.

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COB type LED has the lower thermal resistance than lead frame . Metal substrate appropriate power package.

COB型LED有 较支架低的热阻系数. 是照明用LED最合适之封装结构.

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Die Bonder is manufacturing equipment which binds IC chip onto Lead Frame in semiconductor production.

粘片机是用于将IC芯片粘结到引线框架的半导体器件生产专用装备.

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