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单词 Mcm
释义
  • Mcm

    释义

    • abbr.
      multicopy maintenance 多复制维持[蛋白]

    大小写变形:MCMMcMmcm

  • 实用场景例句

    • 全部

    MCM is an important method of miniaturizing electronic systems.

    多芯片组件(MCM)是实现电子系统小型化的重要手段之一.

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    Multichip module technology ( MCM ) is the optimal way of providing circuIt'system miniaturization.

    多芯片组件技术 ( MCM ) 促使 电路系统 小型化过渡的最好形式.

    互联网

    Then, the trend of MCM in and abroad are introduced.

    然后介绍了国内外MCM的发展动态.

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    D - MCM is an effective method for realizing high - density assembly.

    三维 多芯片组件(3D-MCM)是实现高密度组装的有效手段.

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    The mesoporous silica molecular sieves Zr - MCM - 41 were synthesized in ethylenediamine.

    以乙二胺为碱性介质合成了Zr-MCM-41介孔分子筛.

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    Also we developed a new process for MCM finger attaching.

    我们研究了一种MCM封装 连接端子焊接的工艺设计.

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    Firms like MCM fit into the consultant category.

    MCM公司则属于专业顾问.

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    This paper simply introduces the things of the MCM's concept, division, development and application.

    简要介绍了多芯片组件(MCM) 技术的概念 、 分类 、 发展现状、应用情况等.

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    Thermal cycle test demonstrates that the fatigue life of 3 D - MCM are more than 1500 temperature cycles.

    热循环试验表明,3D-MCM具有大于1500个热循环周期的疲劳寿命,从而具有很高的热机械可靠性.

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    To participate in MCM a team must be sponsored by a faculty advisor from their institution.

    每个MCM的参赛队需有一名所在单位的指导教师负责.

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    Crystallization behavior of zeolite MCM - 22 synthesized a vapor - phase transport method ( VPT ) has been studied.

    本文采用气相转移法 ( VPT ) 对MCM -22 沸石的合成工艺做了较系统的研究.

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    With Object Oriented Programming ( OOP ), MCM - Editor ? s modelshave been coded and debugged in Delphi 5 . O and Windows 98 operation system.

    实现了对MCM-Editor模型的面向对象编程.

    互联网

    The communication interface circuit ( BMC and DDC layer, DDC and MCM layer ) was also discussed.

    通讯和逻辑电路:BMC层与DDC层 通讯和接口电路及 DDC 层与MCM层的通讯接口电路.

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    MCM wants to help see that this development is livable, sustainable and as beautiful as possible.

    MCM愿意帮助中国发展是宜居 、 可持续和尽善尽美的生活环境.

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    By using FC or COB, die products are mounded in the MCM.

    这些芯片级产品可以以fc方式或COB方式安装在封装体中.

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