The destructive physical analysis ( DPA ) is used to detect the semiconductor devices.

破坏性物理分析 ( DPA ) 是用于检测半导体器件的.

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The method of physical analysis including partical size distribution, apparent density and flow rate were introduced.

同时介绍了锌粉颗粒大小分布 、 视密度和流速等物理性能的测试方法.

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