A potential reflow method - laser reflow soldering was expatiated in detail.

着重阐述了一种极具潜力的再流焊方法 ——— 激光再流焊.

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Adapted to the reflow soldering.

适应于回流焊接.

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Suitable for flow and reflow soldering.

适合一般焊接及回焊.

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Suitable for SMT craft reflow soldering.

适用于回流焊SMT工艺.

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Delamination caused by electrical - over - stress ( EOS ) and moisture expansion during reflow soldering have shown different delamination patterns.

由过电应力 ( EOS ) 和再流焊中的水汽膨胀引起的分层会显示出不同的失效模式.

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After reflow soldering and restored at room temperature , they meet the characteristics listed below.

经过回流焊并冷却至室温后,电容器的特性符合下表的要求.

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The product has good heat durability that withstands lead - free compatible reflow soldering conditions.

符合无铅化回流焊接条件,具有耐高温性.

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The techniques multi - layer substrate was developed , and the repeated reflow - soldering problem was also solved.

对封装中的多次回流等工艺难点提出了解决方案.

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Development of advanced electronic package devices promoted the study on the reflow soldering.

先进电子封装器件的出现推动了再流焊方法和设备的研究.

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