Use only with production equipment specifically designed for use with solder paste.

于专为锡膏设计的设备中使用.

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Reflow solder paste in 2 hours as soon as possible after printing.

印刷后要在2小时内回流焊膏.

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Is the average and range of Solder Paste height measurements SPC controlled?

锡膏厚度测量的平均值和间距SPC是否受控?

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Using a manual or pneumatic dispensing device, apply the solder paste to the pads.

使用手动或气动刷锡设备把锡膏刷到焊盘上.

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Solder paste, screen printing, use ways, printing process course will decide the printing quality.

在锡膏印刷工艺中,锡膏 、 丝印机 、 锡膏使用方法和印刷工艺过程将影响到印刷质量.

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Solder - paste printing plays an important in SMT production, and affects the quality of assemblies.

SMT生产工艺决定了电子产品的可靠性, 焊膏印刷质量的好坏是其关键因素之一.

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Is the upper and lower specification limits for individual Solder Paste height measurements also defined?

单点锡膏厚度测量是否定义了其控制上限和下限?

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To achieve the required bump heights, the solder paste is over - printed onto the wafer bond pads.

为了获得要求的凸起高度, 锡膏在晶片焊盘过焊.

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Familiar with lead - free solder paste and at least 3 years related sales experience.

熟悉无铅锡膏产品及市场,具备3年以上行业销售经验.

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The operator should use the solder paste quickly after it has been taken out.

取出的锡膏要尽快实施印刷使用.

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Are LCD's and UCLA's defined for the average and range of Solder Paste measurements?

对锡膏厚度测量的平均值和间距是否定义了其控制上限和下限?

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In surface mount assembly, the stencil is the gateway to accurate, repeatable solder paste deposition.

表面贴装, 钢网是锡膏正确重复印刷的要害.

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Solder - paste printing plays an important part in SMT production, and affects the quality of assemblies.

焊膏印刷是SMT生产 中关键工序之一, 其控制直接影响着组装板的质量.

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In 2003 TOP absorb the adhesive and solder paste by cooperation with UNITEK.

2003年拓普科技与德国UNITEK电化公司合作,引进生产各类电子专用胶粘剂和焊锡膏.

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Using tweezers, place the terminals of the unit on the solder paste print.

使用镊子, 把最终单位放到锡膏印上.

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