The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.
研究了热超声倒装键合设备的核心执行机构——换能系统的动力学特性.
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Ultrasonic transducer is the part of producing ultrasound and supersonic power offers energy to the transducers.
超声波换能器是产生超声场的部件,超声波电源用以驱动超声波换能器,向其提供能量,使之产生超声场.
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