Interface void damage is the failure characteristic of solder joint under temperature cycling.

温度循环载荷可以在焊点界面处形成足以导致空洞损伤发生的高应力三轴度.

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C - UV 9911 is used for encapsulation of IC chips as glob top with excellent temperature cycling performance.

C-UV9911可用于IC芯片的球形封装并具有极佳的温度循环性能.

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Result show that IMC layer increased with the cycles, and it grew faster temperature cycling.

结果表明,随着循环周期的增加,界面IMC层 的厚度增加, 且低温极限温度越低时IMC生长 越快.

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