This technique has been successfully applied in the dimensional measurement of BGA chip leads.

此技术已成功应用于BGA芯片管脚的三维尺寸测量中.

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In large scale integrated chip field, the IC of BGA encapsulation was widely used.

在大规模集成芯片中以BGA( 球栅阵列)封装的IC芯片被广泛使用.

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It avoids PCB crooked or BGA blister from traditional technology of centralizing heating.

优化直向加热的传统技术,防止局部超高温而使线路板跷曲或BGA起泡 等不良影响,有效保护拆焊组件及线路板.

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Unique a 3 segments'temperature curve program achieves a stage heating with good protection of BGA.

独设三段式温度曲线程序,实践分段升温控制,令BGA得到妥贴的保护.

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Desirable for high - performance Ball Grid Array ( BGA ) package .

高性能球形焊点阵列封装需要 倒装焊.

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Assembly of Advanced packages such as Ball Grid Array ( BGA ) and Chip Size Package ( CSP ).

先进封装的装配,如球形焊点阵列和芯片尺寸封装.

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