Pin on the FPGA chip packaging some of the information.
有关FPGA芯片的管脚的封装的一些资料.
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In summary, dry film photo - resist was applied to the wafer level high frequency flip - chip packaging process.
总结来说, 本文证实乾膜光阻适用于晶圆级高频 覆晶封装 制程.
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The purpose of this thesis is to apply dry film photo - resist for high frequency flip - chip packaging .
本论文研究的方向是将乾膜 光阻 应用于高频 覆晶封装 上.
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Business card printing and membership card manufacturing processes after in the chip packaging.
制卡和会员卡制息工序安插在芯片封装后.
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